36-channel, 120 Gigabit/s parallel optical interconnect

Author

Cunningham, J.E. ; Krishnamoorthy, A.V. ; Jan, W.Y.

Author_Institution

AraLight Inc., Monroe Township, NJ, USA

Volume

1

fYear

2003

fDate

27-28 Oct. 2003

Firstpage

156

Abstract

This study reviews preliminary experimental data on accelerated aging test of VCSEL and detector arrays bonded to either silicon or SiGe application specific integrated circuits (ASICs). When compared with top emitting VCSEL (unbonded), results show that the flip chip bonding technology is more robust, reliable, and environmentally sound. In addition, technological benefits of 2-D array technology in terms of superior reliability over linear array solutions when scaling to high channel count is asserted. Moreover, reliability issues for modules are considered as the VCSEL data rate exceed 10 Gbs.

Keywords

application specific integrated circuits; flip-chip devices; integrated circuit bonding; laser cavity resonators; life testing; optical arrays; optical fibre communication; optical interconnections; photodetectors; semiconductor device reliability; semiconductor lasers; surface emitting lasers; 120 Gbit/s; 2-D array technology; SiGe; VCSEL; accelerated aging test; application specific integrated circuits; channel count; detector arrays; flip chip bonding technology; parallel optical interconnect; reliability; silicon; Accelerated aging; Bonding; Circuit testing; Detectors; Integrated circuit reliability; Integrated circuit technology; Integrated circuit testing; Optical interconnections; Sensor arrays; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE

ISSN

1092-8081

Print_ISBN

0-7803-7888-1

Type

conf

DOI

10.1109/LEOS.2003.1251648

Filename

1251648