DocumentCode
399930
Title
Emerging technology for backplanes and chip-to-chip interconnects
Author
Morozov, V.N. ; Guilfoyle, P.S. ; Louderback, D.A.
Author_Institution
OptiComp Corp., Zephyr Cove, NV, USA
Volume
1
fYear
2003
fDate
27-28 Oct. 2003
Firstpage
234
Abstract
A novel approach is developed by Opticomp Corporation (OCC) to achieve reconfigurable optical interconnects. This approach enables high throughput, high switching speed, low latency, protocol independence, scalability, low power dissipation, and monolithic integration. OCC has developed a distributed crossbar switching architecture that provides dynamic reconfigurability, coupled with a natural reduction in latency. A modular implementation of this architecture is well suited for demanding applications such as optical backplanes and chip-to-chip interconnects.
Keywords
integrated optoelectronics; optical backplanes; optical switches; chip-to-chip interconnects; distributed crossbar switching; monolithic integration; optical backplanes; reconfigurable optical interconnects; Arrayed waveguide gratings; Backplanes; Electromagnetic waveguides; Integrated circuit interconnections; Optical arrays; Optical interconnections; Optical receivers; Optical sensors; Optical waveguides; Planar waveguides;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
ISSN
1092-8081
Print_ISBN
0-7803-7888-1
Type
conf
DOI
10.1109/LEOS.2003.1251722
Filename
1251722
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