• DocumentCode
    399930
  • Title

    Emerging technology for backplanes and chip-to-chip interconnects

  • Author

    Morozov, V.N. ; Guilfoyle, P.S. ; Louderback, D.A.

  • Author_Institution
    OptiComp Corp., Zephyr Cove, NV, USA
  • Volume
    1
  • fYear
    2003
  • fDate
    27-28 Oct. 2003
  • Firstpage
    234
  • Abstract
    A novel approach is developed by Opticomp Corporation (OCC) to achieve reconfigurable optical interconnects. This approach enables high throughput, high switching speed, low latency, protocol independence, scalability, low power dissipation, and monolithic integration. OCC has developed a distributed crossbar switching architecture that provides dynamic reconfigurability, coupled with a natural reduction in latency. A modular implementation of this architecture is well suited for demanding applications such as optical backplanes and chip-to-chip interconnects.
  • Keywords
    integrated optoelectronics; optical backplanes; optical switches; chip-to-chip interconnects; distributed crossbar switching; monolithic integration; optical backplanes; reconfigurable optical interconnects; Arrayed waveguide gratings; Backplanes; Electromagnetic waveguides; Integrated circuit interconnections; Optical arrays; Optical interconnections; Optical receivers; Optical sensors; Optical waveguides; Planar waveguides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
  • ISSN
    1092-8081
  • Print_ISBN
    0-7803-7888-1
  • Type

    conf

  • DOI
    10.1109/LEOS.2003.1251722
  • Filename
    1251722