DocumentCode
399988
Title
Opto-electronics packaging techniques for interconnection
Author
Kurata, K. ; Hatakeyama, Ichiro ; Miyoshi, Kazunori ; Shimizu, Takanori ; Sasaki, Jun Ichi ; Kurihara, Mitsw ; Yamamoto, Keisuke
Author_Institution
NEC Corp., Ibaraki, Japan
Volume
1
fYear
2003
fDate
27-28 Oct. 2003
Firstpage
364
Abstract
There is a dilemma in choosing between high density packaging and low loss transmission line. Though the LSI circuit and packaging become high density, the wiring on the printed wire board (PWB) becomes wider over 10 Gbit transmission. This paper introduces opto-electronics packaging techniques which aims to solve the problem of optical interconnection dilemma.
Keywords
integrated circuit packaging; integrated optoelectronics; optical interconnections; LIS circuit; high density packaging; low loss transmission line; optical interconnection; optoelectronics packaging; printed wire board; Energy consumption; Integrated circuit interconnections; Large scale integration; Optical arrays; Optical buffering; Optical interconnections; Optical receivers; Packaging; Stimulated emission; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
ISSN
1092-8081
Print_ISBN
0-7803-7888-1
Type
conf
DOI
10.1109/LEOS.2003.1251801
Filename
1251801
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