Title :
Surface mount photonics as a platform for optoelectronic packaging
Author :
Vernooy, David W. ; Benzoni, Albert M. ; Blauvelt, Henry A. ; Paslaski, Joel S.
Author_Institution :
Xponent Photonics Inc., Monrovia, CA, USA
Abstract :
A planar lightwave circuit (PLC) based optoelectronic packaging platform is described. Features include completely passive, performance-insensitive alignment for all devices to +/- 2 microns, glob-top encapsulation to eliminate hermetic packaging and wafer-level test and burn-in.
Keywords :
chip scale packaging; flip-chip devices; integrated optics; integrated optoelectronics; optical interconnections; surface mount technology; glob-top encapsulation; optoelectronic packaging; passive alignment; performance-insensitive alignment; planar lightwave circuit; surface mount photonics; wafer-level burn-in; wafer-level test; Assembly; Costs; Optical devices; Optical fiber devices; Optical fiber polarization; Optical waveguides; Photonics; Programmable control; Semiconductor device packaging; Wafer scale integration;
Conference_Titel :
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
Print_ISBN :
0-7803-7888-1
DOI :
10.1109/LEOS.2003.1251807
