DocumentCode
400359
Title
An ELO-VCSEL tile integrated on CMOS IC with polyimide bonding and nano paste metallization
Author
Kondo, Taka-Yuki ; Shimoda, Tatsuya ; Kitamura, Shojiro ; Nimura, Yoshihiko ; Kaneko, Takeo
Author_Institution
Technol. Platform Res. Center, Seiko Epson Corp., Japan
Volume
2
fYear
2003
fDate
27-28 Oct. 2003
Firstpage
648
Abstract
In this work, we present results on the monolithically assembly of VCSEL and CMOS IC using epitaxial liftoff (ELO), polyimide bonding and paste metallization. And we also demonstrate results of high frequency driving of the integrated devices.
Keywords
CMOS integrated circuits; epitaxial growth; integrated circuit bonding; integrated circuit metallisation; integrated optics; monolithic integrated circuits; nanotechnology; surface emitting lasers; CMOS IC; ELO-VCSEL tile; epitaxial liftoff; high frequency driving; integrated device; monolithic assembly; nano paste metallization; polyimide bonding; CMOS integrated circuits; Etching; Frequency; Gallium arsenide; Integrated circuit interconnections; Metallization; Polyimides; Tiles; Vertical cavity surface emitting lasers; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society, 2003. LEOS 2003. The 16th Annual Meeting of the IEEE
ISSN
1092-8081
Print_ISBN
0-7803-7888-1
Type
conf
DOI
10.1109/LEOS.2003.1252967
Filename
1252967
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