DocumentCode
400447
Title
Modeling and evaluation of substrate noise induced by interconnects
Author
Martorell, Ferran ; Mateo, Diego ; Aragonés, Xavier
Author_Institution
Electron. Eng. Dept, Univ. Politecnica de Catalunya, Barcelona, Spain
fYear
2003
fDate
2003
Firstpage
524
Lastpage
529
Abstract
Interconnects have deserved attention as a source of crosstalk to other interconnects, but have been ignored as a source of substrate noise. In this paper, we evaluate the importance of interconnect-induced substrate noise. A known interconnect and substrate model is validated by comparing simulation results to experimental measurements. Based on the validated modeling approach, a complete study considering frequency, geometrical, load and shielding effects is presented The importance of interconnect-induced substrate noise is demonstrated after observing that, for typically sized interconnects and stale-of-the-art speeds, the amount of coupled noise is already comparable to that injected by hundreds of transistors.
Keywords
integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; shielding; coupled noise; frequency effects; geometrical effects; interconnects; load effects; shielding effects; substrate noise; validated modeling approach; Circuit noise; Coupling circuits; Crosstalk; Finite difference methods; Frequency; Impedance; Integrated circuit interconnections; Integrated circuit noise; Solid modeling; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe Conference and Exhibition, 2003
ISSN
1530-1591
Print_ISBN
0-7695-1870-2
Type
conf
DOI
10.1109/DATE.2003.1253662
Filename
1253662
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