• DocumentCode
    400447
  • Title

    Modeling and evaluation of substrate noise induced by interconnects

  • Author

    Martorell, Ferran ; Mateo, Diego ; Aragonés, Xavier

  • Author_Institution
    Electron. Eng. Dept, Univ. Politecnica de Catalunya, Barcelona, Spain
  • fYear
    2003
  • fDate
    2003
  • Firstpage
    524
  • Lastpage
    529
  • Abstract
    Interconnects have deserved attention as a source of crosstalk to other interconnects, but have been ignored as a source of substrate noise. In this paper, we evaluate the importance of interconnect-induced substrate noise. A known interconnect and substrate model is validated by comparing simulation results to experimental measurements. Based on the validated modeling approach, a complete study considering frequency, geometrical, load and shielding effects is presented The importance of interconnect-induced substrate noise is demonstrated after observing that, for typically sized interconnects and stale-of-the-art speeds, the amount of coupled noise is already comparable to that injected by hundreds of transistors.
  • Keywords
    integrated circuit interconnections; integrated circuit modelling; integrated circuit noise; shielding; coupled noise; frequency effects; geometrical effects; interconnects; load effects; shielding effects; substrate noise; validated modeling approach; Circuit noise; Coupling circuits; Crosstalk; Finite difference methods; Frequency; Impedance; Integrated circuit interconnections; Integrated circuit noise; Solid modeling; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe Conference and Exhibition, 2003
  • ISSN
    1530-1591
  • Print_ISBN
    0-7695-1870-2
  • Type

    conf

  • DOI
    10.1109/DATE.2003.1253662
  • Filename
    1253662