Title :
Thermal stress and intrinsic residual stress in embedded power modules
Author :
Zhu, N. ; Lee, S.Y. ; van Wyk, J.D. ; Odendaal, W.G. ; Liang, Z.X.
Author_Institution :
Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Abstract :
In embedded power modules, mechanical properties of interfaces between deposited copper traces and substrates are important for reliable operation. This paper investigates the values of thermal-mechanical stresses by IDEAS simulation, and describes an experimental method to calculate intrinsic residual stresses using Stoney equation based on the sample bending curvature.
Keywords :
bending; internal stresses; modules; power electronics; stress measurement; substrates; thermal stresses; IDEAS simulation; Stoney equation; bending curvature; deposited copper traces; embedded power; embedded power modules; intrinsic residual stress; intrinsic residual stresses; mechanical properties; power electronics; substrates; thermal stress; thermal-mechanical stress; thermal-mechanical stresses; Ceramics; Copper; Dielectric substrates; Integrated circuit interconnections; Metallization; Multichip modules; Power electronics; Protection; Residual stresses; Thermal stresses;
Conference_Titel :
Industry Applications Conference, 2003. 38th IAS Annual Meeting. Conference Record of the
Print_ISBN :
0-7803-7883-0
DOI :
10.1109/IAS.2003.1257709
