DocumentCode
400848
Title
Issues involved in the use of an As++ punch-through implant for a PMOS transistor
Author
Daryanani, S. ; Suda, D.
fYear
2002
fDate
27-27 Sept. 2002
Firstpage
213
Lastpage
216
Abstract
Use of an arsenic (As) punch-through implant in 0.5μm PMOS transistors is shown to have the benefits of better short channel characteristics for an equivalent junction breakdown voltage when compared to a phosphorous implant. Implementation of this double charged implant in a production flow however gave rise to problems in the Vt control of the devices. An energy contamination issue has been identified that depends on the type of source that is used in the implanter. This was confirmed by SIMS analysis. Further study points to the breakup of the As2 dimer as the cause of the energy contamination. The As++/As2 ratio was found to depend on the type of source used. An optimization of source conditions is presented which lowers the risk of this contamination and gives stable transistor Vt´s. It is also shown that proper dose matching of this implant is crucial in Vt control due to the strong influence of the tail of this implant on the transistor Vt.
Keywords
CMOS integrated circuits; MOSFET; arsenic; ion implantation; secondary ion mass spectra; semiconductor device breakdown; semiconductor doping; 0.5 micron; As2; As++; As++ punch-through implant; As++/As2 ratio; PMOS transistor; SIMS; dose matching; double charged implant; energy contamination; equivalent junction breakdown voltage; production flow; short channel characteristics; Cathodes; Contamination; Flow production systems; Implants; MOSFETs; Pollution measurement; Resists; Subthreshold current; Tail; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location
Taos, New Mexico, USA
Print_ISBN
0-7803-7155-0
Type
conf
DOI
10.1109/IIT.2002.1257976
Filename
1257976
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