DocumentCode
400850
Title
Integrated implant-RTP process monitor using solid phase epitaxy activation
Author
MacKinnon, S.L. ; Batinica, G. ; Clayton, Steven ; Csanadi, O.
fYear
2002
fDate
27-27 Sept. 2002
Firstpage
225
Lastpage
228
Abstract
A low-cost, integrated ion implant-rapid thermal processor (RTP), SPC monitor has been developed to provide quick feedback for implant and RTP conditions critical to SPAWAR Systems Center, San Diego´s (SSC San Diego) radiation hardened technologies. Low temperature solid phase epitaxy (SPE) was leveraged to achieve stable, reproducible responses at activation temperatures considerably below those used in conventional furnaces. Instabilities inherent to SPE processing required the design of experiment approach to determine implant and RTP conditions close to those used in SSC San Diego´s baseline SOI technology, yet insensitive to room temperature drift (SPE-relaxation). A response methodology has been created to first isolate the cause of out-of-control signals to either the implanter or RTP system. Then, regression analyses on the response surface was used to quantify the drift in either dosimetry or temperature control.
Keywords
ion implantation; rapid thermal annealing; semiconductor doping; semiconductor growth; solid phase epitaxial growth; instabilities; integrated implant-RTP process monitor; quick feedback; radiation hardened technologies; regression analyses; response methodology; response surface; solid phase epitaxy activation; Condition monitoring; Epitaxial growth; Feedback; Furnaces; Implants; Process design; Radiation hardening; Radiation monitoring; Solids; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location
Taos, New Mexico, USA
Print_ISBN
0-7803-7155-0
Type
conf
DOI
10.1109/IIT.2002.1257979
Filename
1257979
Link To Document