• DocumentCode
    400896
  • Title

    Germanium operation on the GSDIII/LED and ultra high current ion implanters

  • Author

    Freer, B.S. ; Rutishauser, H. ; Tieger, D.R. ; Graf, M.A. ; Stone, Maureen ; Matsushita, Haruna ; Muto, Hirotaka ; Kabasawa, Mitsuaki

  • fYear
    2002
  • fDate
    27-27 Sept. 2002
  • Firstpage
    420
  • Lastpage
    423
  • Abstract
    Germanium is typically used in ultra-shallow junction formation as an amorphization implant to reduce channeling in subsequent low energy boron dopant implants. Several equipment and process considerations can be associated with germanium operation. For example, source life may be adversely affected due to the cycling of refractory metal fluorides from materials used in the arc chamber, and cross-contamination, especially implanted As, may occur on machines that run multiple species. Tool productivity also depends on beam current and beam setup time due to the relatively high doses and low energies required. A number of design and operational improvements have been implemented on the GSDIII/LED and Ultra to address these concerns. Hardware and tuning algorithms for germanium operation are described. Data showing improved source lifetime and low species cross-contamination are presented Strategies for achieving productivity, flexibility, and cycle time improvements, including mixed species operation and germanium-boron chaining, are discussed.
  • Keywords
    amorphisation; germanium; ion implantation; ion sources; semiconductor doping; GSDIII/LED; Ge; amorphization implant; beam current; beam setup time; cycle time improvements; equipment considerations; flexibility; hardware; high doses; low energies; low species cross-contamination; process considerations; productivity; refractory metal fluorides cycling; source life; source lifetime; tool productivity; tuning algorithms; ultra high current ion implanters; ultra-shallow junction formation; Apertures; Boron; Contamination; Germanium; Implants; Inorganic materials; Isotopes; Light emitting diodes; Productivity; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
  • Conference_Location
    Taos, New Mexico, USA
  • Print_ISBN
    0-7803-7155-0
  • Type

    conf

  • DOI
    10.1109/IIT.2002.1258030
  • Filename
    1258030