• DocumentCode
    400897
  • Title

    Evaluation and integration of a new gas source package for boron trifluoride used in ion implantation

  • Author

    Mckee, D.J. ; Van Horn, L.J.

  • fYear
    2002
  • fDate
    27-27 Sept. 2002
  • Firstpage
    424
  • Lastpage
    427
  • Abstract
    A new reduced risk packaging technology for boron trifluoride gas was tested at Agere Systems MOS 5 (formerly Lucent Technologies) Allentown, Pa. semiconductor fabrication facility. Produced by ATMI, Inc. of Danbury, Ct. the VAC™ package allows for high capacity storage of corrosive and flammable gases while dispensing only at sub-atmospheric pressure for the ion implant application. This paper reports the results of a test program utilizing this product on an Axcelis GSD200E ion implanter in a production environment at Agere Systems.
  • Keywords
    boron compounds; ion implantation; ion sources; semiconductor doping; BF3; GSD200E ion implanter; corrosive gases; flammable gases; gas source package; high capacity storage; ion implantation; reduced risk packaging technology; sub-atmospheric pressure; Boron; Fabrication; Flammability; Gases; Implants; Ion implantation; Production systems; Semiconductor device packaging; Semiconductor device testing; System testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
  • Conference_Location
    Taos, New Mexico, USA
  • Print_ISBN
    0-7803-7155-0
  • Type

    conf

  • DOI
    10.1109/IIT.2002.1258031
  • Filename
    1258031
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=400897