Title :
Evaluation and integration of a new gas source package for boron trifluoride used in ion implantation
Author :
Mckee, D.J. ; Van Horn, L.J.
Abstract :
A new reduced risk packaging technology for boron trifluoride gas was tested at Agere Systems MOS 5 (formerly Lucent Technologies) Allentown, Pa. semiconductor fabrication facility. Produced by ATMI, Inc. of Danbury, Ct. the VAC™ package allows for high capacity storage of corrosive and flammable gases while dispensing only at sub-atmospheric pressure for the ion implant application. This paper reports the results of a test program utilizing this product on an Axcelis GSD200E ion implanter in a production environment at Agere Systems.
Keywords :
boron compounds; ion implantation; ion sources; semiconductor doping; BF3; GSD200E ion implanter; corrosive gases; flammable gases; gas source package; high capacity storage; ion implantation; reduced risk packaging technology; sub-atmospheric pressure; Boron; Fabrication; Flammability; Gases; Implants; Ion implantation; Production systems; Semiconductor device packaging; Semiconductor device testing; System testing;
Conference_Titel :
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location :
Taos, New Mexico, USA
Print_ISBN :
0-7803-7155-0
DOI :
10.1109/IIT.2002.1258031
