DocumentCode
400898
Title
Oxygen implants using water vapor as source feed gas in high and medium current implanters
Author
Platow, Wilhelm ; Todorov, Stan
fYear
2002
fDate
27-27 Sept. 2002
Firstpage
428
Lastpage
431
Abstract
Refractory metals used in ion sources (such as tungsten) will oxidize using ordinary oxygen bearing gases for oxygen implantation. By comparing the free energy of formation of different feed gases with tungsten oxide it was found that for temperatures between 960°C and 3300°C tungsten will preferably not oxidize in a water vapor environment. For high current implanters the tungsten arc chamber walls and filaments operate in this temperature range, making water a viable feed gas for O+ implants. Stable beam currents of up to 7.5 mA have been achieved.
Keywords
free energy; ion implantation; oxygen; semiconductor doping; tungsten; 7.5 mA; 960 to 3300 degC; H2O; O; O implants; W; free energy of formation; high current implanters; ion sources; medium current implanters; refractory metals; source feed gas; stable beam currents; water vapor; Feeds; Gases; Implants; Ion sources; Isotopes; Oxidation; Oxygen; Temperature distribution; Tungsten; Water resources;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location
Taos, New Mexico, USA
Print_ISBN
0-7803-7155-0
Type
conf
DOI
10.1109/IIT.2002.1258032
Filename
1258032
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