• DocumentCode
    400898
  • Title

    Oxygen implants using water vapor as source feed gas in high and medium current implanters

  • Author

    Platow, Wilhelm ; Todorov, Stan

  • fYear
    2002
  • fDate
    27-27 Sept. 2002
  • Firstpage
    428
  • Lastpage
    431
  • Abstract
    Refractory metals used in ion sources (such as tungsten) will oxidize using ordinary oxygen bearing gases for oxygen implantation. By comparing the free energy of formation of different feed gases with tungsten oxide it was found that for temperatures between 960°C and 3300°C tungsten will preferably not oxidize in a water vapor environment. For high current implanters the tungsten arc chamber walls and filaments operate in this temperature range, making water a viable feed gas for O+ implants. Stable beam currents of up to 7.5 mA have been achieved.
  • Keywords
    free energy; ion implantation; oxygen; semiconductor doping; tungsten; 7.5 mA; 960 to 3300 degC; H2O; O; O implants; W; free energy of formation; high current implanters; ion sources; medium current implanters; refractory metals; source feed gas; stable beam currents; water vapor; Feeds; Gases; Implants; Ion sources; Isotopes; Oxidation; Oxygen; Temperature distribution; Tungsten; Water resources;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
  • Conference_Location
    Taos, New Mexico, USA
  • Print_ISBN
    0-7803-7155-0
  • Type

    conf

  • DOI
    10.1109/IIT.2002.1258032
  • Filename
    1258032