• DocumentCode
    400936
  • Title

    Sputtering of Si with decaborane cluster ions

  • Author

    Cheng Li ; Gladczuk, L. ; Sosnowski, M. ; Gossmann, Hans-Joachim L.

  • fYear
    2002
  • fDate
    27-27 Sept. 2002
  • Firstpage
    583
  • Lastpage
    586
  • Abstract
    Decaborane cluster ions (B10Hx+) may play an important role in the manufacturing of future MOS devices, as they facilitate a very shallow implantation of B with relatively high beam energy, which is partitioned among the constituent atoms. While the formation of B-doped shallow junctions in Si has been demonstrated, little is known about other effects of these complex ions on a solid. We have measured the sputtering yield of Si with decaborane cluster ions at 12 keV and demonstrated, by atomic force microscopy of the surface, that their impacts smooth rather than roughen the surface, similarly to much larger Ar cluster ions. This unexpected result has implications for the understanding of the mechanism of impacts of molecular and cluster ions.
  • Keywords
    boron compounds; elemental semiconductors; ion implantation; ion-surface impact; semiconductor doping; silicon; sputtering; 12 keV; B10Hx+; MOS devices; Si; atomic force microscopy; decaborane cluster ions; relatively high beam energy; sputtering yield; very shallow implantation; Atomic beams; Atomic force microscopy; Atomic measurements; Force measurement; MOS devices; Manufacturing; Rough surfaces; Solids; Sputtering; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
  • Conference_Location
    Taos, New Mexico, USA
  • Print_ISBN
    0-7803-7155-0
  • Type

    conf

  • DOI
    10.1109/IIT.2002.1258072
  • Filename
    1258072