DocumentCode
400936
Title
Sputtering of Si with decaborane cluster ions
Author
Cheng Li ; Gladczuk, L. ; Sosnowski, M. ; Gossmann, Hans-Joachim L.
fYear
2002
fDate
27-27 Sept. 2002
Firstpage
583
Lastpage
586
Abstract
Decaborane cluster ions (B10Hx+) may play an important role in the manufacturing of future MOS devices, as they facilitate a very shallow implantation of B with relatively high beam energy, which is partitioned among the constituent atoms. While the formation of B-doped shallow junctions in Si has been demonstrated, little is known about other effects of these complex ions on a solid. We have measured the sputtering yield of Si with decaborane cluster ions at 12 keV and demonstrated, by atomic force microscopy of the surface, that their impacts smooth rather than roughen the surface, similarly to much larger Ar cluster ions. This unexpected result has implications for the understanding of the mechanism of impacts of molecular and cluster ions.
Keywords
boron compounds; elemental semiconductors; ion implantation; ion-surface impact; semiconductor doping; silicon; sputtering; 12 keV; B10Hx+; MOS devices; Si; atomic force microscopy; decaborane cluster ions; relatively high beam energy; sputtering yield; very shallow implantation; Atomic beams; Atomic force microscopy; Atomic measurements; Force measurement; MOS devices; Manufacturing; Rough surfaces; Solids; Sputtering; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location
Taos, New Mexico, USA
Print_ISBN
0-7803-7155-0
Type
conf
DOI
10.1109/IIT.2002.1258072
Filename
1258072
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