Title :
High quality optical thin film formation with low energy gas cluster ion beam irradiation
Author :
Toyoda, Noriaki ; Yamada, Isao
Abstract :
O2 gas cluster ion beam (O2-GCIB) assisted depositions were employed to deposit high quality dielectric films (Ta2O5, Nb2O5 and SiO2). The optimum irradiation energy and ion current density for Ta2O5 and Nb2O5 film were 5 to 9 keV and 0.5 μA/cm2, respectively. The Nb2O5/SiO2 films deposited with O2-GCIB irradiation showed very uniform and dense structures without columnar or porous structures. Due to the significant surface roughness improvement effect of GCIB, the interface and top surface of Nb2O5/SiO2 multi-layer were quite flat. The interference filter deposited with O2-GCIB assist deposition was very stable and there was no shift of wavelength before and after environmental tests. As O2-GCIB is equivalently very low-energy ion beam and is able to deposit flat and dense amorphous films at low substrate temperature, it suitable for deposition of multi-layered films where low-energy assisting ions are required.
Keywords :
electron beam deposition; interference filters; ion beam assisted deposition; niobium compounds; optical multilayers; refractive index; silicon compounds; surface roughness; tantalum compounds; Nb2O5; SiO2; Ta2O5; acceleration energy dependence; cluster ion beam assisted depositions; cross-sectional SEM; dielectric films; electron beam evaporator; high quality film formation; interference filter; ion current density; low energy gas cluster ion beam irradiation; multilayered films; optical thin film formation; optimum irradiation energy; refractive index; surface roughness improvement; uniform dense structures; Current density; Dielectric films; Filters; Interference; Ion beams; Niobium; Optical films; Optical surface waves; Rough surfaces; Surface roughness;
Conference_Titel :
Ion Implantation Technology. 2002. Proceedings of the 14th International Conference on
Conference_Location :
Taos, New Mexico, USA
Print_ISBN :
0-7803-7155-0
DOI :
10.1109/IIT.2002.1258102