Title :
High-performance integrated RF-MEMS: Part 1 - The process
Author :
Morris, Arthur S., III ; Cunningham, Shawn ; DeReus, D. ; Schropfer, Gerold
Author_Institution :
wiSpry Inc., Cary, NC, USA
Abstract :
RF MEMS have been pursued for more than a decade as a solution to high-performance on-chip fixed, tunable and switchable passives. However, the implementation of RF-MEMS into products has remained elusive. This is partly due to special-purpose processes that only supported a narrow application field, in many cases optimized for single devices. This prevented aggregation of volumes to justify the manufacturing infrastructure of even a single production foundry. This paper presents a single process that has been implemented in multiple foundries and highlights a wide range of high-performance devices including switches, inductors, varactors, and phase-shifters that have been or are being built using this process. This process thus forms the foundation for a wide range of reconfigurable and tunable RF passive circuits.
Keywords :
chemical mechanical polishing; inductors; micromechanical devices; microswitches; microwave integrated circuits; microwave phase shifters; microwave switches; planarisation; varactors; CMP; buried conductors; high-performance MEMS; inductors; integrated RF-MEMS; multiple foundries; phase-shifters; planarized surface; process stack; reconfigurable circuits; switchable passives; switches; tunable passives; varactors; Foundries; Inductors; Manufacturing; Passive circuits; Production; Radio frequency; Radiofrequency microelectromechanical systems; Switches; Tunable circuits and devices; Varactors;
Conference_Titel :
Microwave Conference, 2003. 33rd European
Print_ISBN :
1-58053-834-7
DOI :
10.1109/EUMC.2003.1262208