A hybrid FDTD/quasistatic technique for the accurate modeling of complex integrated structures including effects of lossy metals

Author

Dalton, E.T.K. ; Kunze, M. ; Heinrich, W. ; Tentzeris, M.M.

Author_Institution

Dept. of Electr. Eng. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

1

fYear

2003

fDate

7-9 Oct. 2003

Firstpage

331

Abstract

This paper presents a method of coupling a quasistatic field solver with the finite-difference time-domain method for the more efficient modeling of multilayer packaging structures including metal and dielectric loss effects. Lossy metal characteristics are first simulated with a dense quasistatic grid and the resulting field correction factors are then used to enhance the accuracy of a much coarser FDTD mesh.

Keywords

absorbing media; computational electromagnetics; electric field integral equations; finite difference time-domain analysis; magnetic field integral equations; microstrip lines; modules; waveguide theory; dense quasistatic grid; dielectric loss effects; efficient modeling; electromagnetic fields; field correction factors; finite-difference time-domain method; hybrid technique; integral correction factor; lossy metal characteristics; microstrip structure; multilayer packaging structures; quasistatic field solver; Computational modeling; Conducting materials; Dielectric losses; Finite difference methods; Integral equations; Metallization; Nonhomogeneous media; Packaging; Radio frequency; Time domain analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2003. 33rd European

Print_ISBN

1-58053-834-7

Type

conf

DOI

10.1109/EUMC.2003.1262286

Filename

1262286