Title :
Vertical feedthroughs for millimeter-wave LTCC modules
Author :
Heyen, Johann ; Gordiyenko, Andriy ; Heide, Patric ; Jacob, Arne F.
Author_Institution :
Inst. fur Hochfrequenztech., Technische Univ. Braunschweig, Germany
Abstract :
This paper reports on novel types of vertical interconnects to be incorporated inside highly integrated LTCC Modules (Low Temperature Co-fired Ceramics). RF-transitions vertically interconnecting the top and bottom side of the LTCC are studied using alternatively CPW (coplanar waveguide) or microstrip feedlines. Vertical DC supply and control lines with integrated RF blocking capacitors are also demonstrated. LTCC test modules were fabricated and the performance of all feedthroughs successfully validated by scattering parameter measurements up to 40 GHz.
Keywords :
MIMIC; S-parameters; ceramic packaging; coplanar waveguides; microstrip transitions; multichip modules; 3D integration; 40 GHz; BGA interface; CPW feedlines; RF transitions; integrated blocking capacitors; microstrip feedlines; millimeter-wave LTCC modules; multichip modules; scattering parameters; vertical feedthroughs; vertical interconnects; Coplanar waveguides; Dielectric substrates; Integrated circuit interconnections; Integrated circuit packaging; MMICs; Microstrip; Millimeter wave technology; RF signals; Radio frequency; Testing;
Conference_Titel :
Microwave Conference, 2003. 33rd European
Print_ISBN :
1-58053-834-7
DOI :
10.1109/EUMC.2003.1262309
