DocumentCode :
402400
Title :
Microwave heating for accelerated fabrication of parquet
Author :
Kayser, Thorsten ; Sörgel, Werner ; Von Hagen, Jürgen ; Wiesbeck, Werner
Author_Institution :
Inst. fur Hochstfrequenztech. und Elektron., Univ. Karlsruhe, Germany
Volume :
3
fYear :
2003
fDate :
7-9 Oct. 2003
Firstpage :
1333
Abstract :
This paper presents a new microwave accelerated process for adhesion of parquet Parquet consists of two or three layers of wood, sticked together with glue. By using microwaves it is possible to heat the glue directly such that the curing time for the glue can be reduced, resulting in a shorter cycle time and higher productivity. To optimise the process one needs to know the properties of involved materials. This paper shows, that the combination of wood and glue is ideal for microwave processing. To verify the capability for industrial processes, results of heating experiments at 2.45 GHz with a real microwave adapted parquet press are presented.
Keywords :
adhesion; adhesives; microwave heating; wood; adhesion; curing time; glue; microwave accelerated process; microwave heating; parquet press; Acceleration; Attenuation; Curing; Dielectric materials; Dielectric measurements; Electromagnetic heating; Fabrication; Frequency; Permittivity measurement; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference, 2003. 33rd European
Print_ISBN :
1-58053-834-7
Type :
conf
DOI :
10.1109/EUMC.2003.1262904
Filename :
1262904
Link To Document :
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