Multi-layer parasitic microstrip array antenna on LTCC substrate for millimeter-wave system-on-package

Author

Seki, Tomohiro ; Nishikawa, Kenjiro ; Cho, Keizo

Author_Institution

NTT Network Innovation Lab., NTT Corp., Kanagawa, Japan

Volume

3

fYear

2003

fDate

7-9 Oct. 2003

Firstpage

1393

Abstract

This paper proposes a novel multi-layer parasitic microstrip array antenna (MPMAA) structure for compact and low-cost quasi-millimeter-wave and millimeter-wave system-on-package modules. The design and performance of the proposed array antenna are described. The developed prototype MPMAA employs a multi-layer low-temperature co-fired ceramic (LTCC) substrate that is well suited to the assembly of MMIC chips. The fabricated MPMAA exhibits a -16 dB return loss and a 50-degree 3-dB beam width at 25 GHz. The spacing of the top layer of the parasitic array constructed by 2×2 elements has a free space wavelength of 0.37. The fabricated MPMAA realizes both compact and high directional gain.

Keywords

ceramic packaging; integrated circuit design; integrated circuit modelling; microstrip antenna arrays; millimetre wave antenna arrays; system-on-chip; 16 dB; 25 GHz; 3 dB; LTCC substrate; MMIC; free space wavelength; millimeter wave system; multilayer low temperature cofired ceramic substrate; multilayer parasitic microstrip array antenna; package modules; Antenna feeds; Circuits; Lenses; MMICs; Microstrip antenna arrays; Microstrip antennas; Millimeter wave technology; Packaging; Prototypes; Radio frequency;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2003. 33rd European

Print_ISBN

1-58053-834-7

Type

conf

DOI

10.1109/EUMC.2003.1262919

Filename

1262919