DocumentCode
403511
Title
How can system level design solve the interconnect technology scaling problem?
Author
Catthoor, Francky ; Cuomo, Andrea ; Martin, Grant ; Groeneveld, Patrick ; Rudy, Lauwereins ; Maex, Karen ; Van De Steeg, Patrick ; Wilson, Ron
Volume
1
fYear
2004
fDate
16-20 Feb. 2004
Firstpage
332
Abstract
The scaling of interconnect technology hits a red brick wall: interconnect delay and power do not follow Moore´s law any more. The use of new materials like Cu and low-k alleviated the problem temporarily, but physical limits are being hit. What does this mean for system level design? The session starts with an embedded tutorial, given by an interconnect semiconductor technology expert, explaining the physics behind the interconnect problem and the degrees of freedom semiconductor technology offers system designers. Panelists will then express their thoughts and discuss with you how the interconnect problem can be solved by taking these degrees of freedom into account at the system design level. Views from industrial designers, CAD vendors, IC manufacturers and researchers will be presented.
Keywords
circuit layout CAD; integrated circuit design; integrated circuit interconnections; Moore law; interconnect delay; interconnect semiconductor technology; interconnect technology scaling problem; system level design; Computer aided manufacturing; Delay; Design automation; Manufacturing industries; Moore´s Law; Physics; Power system interconnection; Semiconductor device manufacture; Semiconductor materials; System-level design;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation and Test in Europe Conference and Exhibition, 2004. Proceedings
ISSN
1530-1591
Print_ISBN
0-7695-2085-5
Type
conf
DOI
10.1109/DATE.2004.1268869
Filename
1268869
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