• DocumentCode
    403511
  • Title

    How can system level design solve the interconnect technology scaling problem?

  • Author

    Catthoor, Francky ; Cuomo, Andrea ; Martin, Grant ; Groeneveld, Patrick ; Rudy, Lauwereins ; Maex, Karen ; Van De Steeg, Patrick ; Wilson, Ron

  • Volume
    1
  • fYear
    2004
  • fDate
    16-20 Feb. 2004
  • Firstpage
    332
  • Abstract
    The scaling of interconnect technology hits a red brick wall: interconnect delay and power do not follow Moore´s law any more. The use of new materials like Cu and low-k alleviated the problem temporarily, but physical limits are being hit. What does this mean for system level design? The session starts with an embedded tutorial, given by an interconnect semiconductor technology expert, explaining the physics behind the interconnect problem and the degrees of freedom semiconductor technology offers system designers. Panelists will then express their thoughts and discuss with you how the interconnect problem can be solved by taking these degrees of freedom into account at the system design level. Views from industrial designers, CAD vendors, IC manufacturers and researchers will be presented.
  • Keywords
    circuit layout CAD; integrated circuit design; integrated circuit interconnections; Moore law; interconnect delay; interconnect semiconductor technology; interconnect technology scaling problem; system level design; Computer aided manufacturing; Delay; Design automation; Manufacturing industries; Moore´s Law; Physics; Power system interconnection; Semiconductor device manufacture; Semiconductor materials; System-level design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe Conference and Exhibition, 2004. Proceedings
  • ISSN
    1530-1591
  • Print_ISBN
    0-7695-2085-5
  • Type

    conf

  • DOI
    10.1109/DATE.2004.1268869
  • Filename
    1268869