Net and pin distribution for 3D package global routing

Author

Minz, Jacob R. ; Pathak, Mohit ; Lim, Sung Kyu

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

2

fYear

2004

fDate

16-20 Feb. 2004

Firstpage

1410

Abstract

In this paper, we study the net and pin distribution problem for global routing targeting three dimensional packaging layout via system-on-package (SOP). The routing environment for the new emerging mixed-signal SOP technology is more advanced than that of the conventional PCB or MCM technology - pins are located at all layers of SOP packaging substrate rather than the top-most layer only. This is the first work to formulate and solve the multi-layer net and pin distribution for layer, wirelength, and crosstalk minimization.

Keywords

circuit optimisation; electronics packaging; network routing; printed circuits; 3D package global routing; PCB technology; crosstalk minimization; layer minimization; net distribution algorithm; pin distribution algorithm; printed circuit board technology; system-on-package; three dimensional package global routing; wirelength minimization; Crosstalk; Design automation; Distributed computing; Jacobian matrices; Law; Legal factors; Packaging; Pins; Routing; Topology;

fLanguage

English

Publisher

ieee

Conference_Titel

Design, Automation and Test in Europe Conference and Exhibition, 2004. Proceedings

ISSN

1530-1591

Print_ISBN

0-7695-2085-5

Type

conf

DOI

10.1109/DATE.2004.1269111

Filename

1269111