Author_Institution :
Carnegie Mellon University
fDate :
Sept. 30-Oct. 2, 2003
Keywords :
CMOS process; Conducting materials; Fabrication; Magnetic field measurement; Micromachining; Micromechanical devices; Microstructure; Silicon; Thermal stresses; Wet etching;
Conference_Titel :
Test Conference, 2003. Proceedings. ITC 2003. International
Print_ISBN :
0-7803-8106-8
DOI :
10.1109/TEST.2003.1270898
