Title :
Diagnosis in modem design to volume the tip of the iceberg
Author_Institution :
IBM Corporation
fDate :
Sept. 30-Oct. 2, 2003
Keywords :
Art; Chip scale packaging; Circuit testing; Design for disassembly; Design for testability; Manufacturing; Microprocessors; Modems; Silicon; Test equipment;
Conference_Titel :
Test Conference, 2003. Proceedings. ITC 2003. International
Print_ISBN :
0-7803-8106-8
DOI :
10.1109/TEST.2003.1271144
