DocumentCode :
4041
Title :
Impact of Stress Mode on Stochastic BTI in Scaled MG/HK CMOS Devices
Author :
Kerber, Andreas ; Srinivasan, P.
Author_Institution :
Globalfoundries, Inc., Yorktown Heights, NY, USA
Volume :
35
Issue :
4
fYear :
2014
fDate :
Apr-14
Firstpage :
431
Lastpage :
433
Abstract :
Stochastic bias temperature instability (BTI) modeling has gained importance for scaled metal gate/high- k CMOS devices to ensure SRAM circuit functionality. In this letter, we discuss the impact of the BTI stress mode on the ΔVT distribution and the time evolution of VT in small and large area CMOS devices. It is shown that the stress mode has strong impact on the evolution of the threshold voltage distribution in small area devices leading to an increase in the σ-value for constant overdrive stress, whereas no change is observed for constant voltage stress. Since CMOS circuits share the supply voltage, the constant voltage stress σ-values are relevant and thus, the reliability guidance for future CMOS design should be based on constant voltage stress.
Keywords :
CMOS integrated circuits; SRAM chips; high-k dielectric thin films; integrated circuit modelling; integrated circuit reliability; negative bias temperature instability; stochastic processes; σ-value; SRAM circuit functionality; constant overdrive stress; constant voltage stress; reliability guidance; scaled metal gate-high-k CMOS devices; stochastic BTI modeling; stochastic bias temperature instability; stress mode; threshold voltage distribution; CMOS integrated circuits; Correlation; Field effect transistors; Logic gates; Stochastic processes; Stress; Threshold voltage; Bias temperature instability; CMOS devices; high-$k$ dielectrics; metal gate; variability;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2014.2304532
Filename :
6748015
Link To Document :
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