• DocumentCode
    4041
  • Title

    Impact of Stress Mode on Stochastic BTI in Scaled MG/HK CMOS Devices

  • Author

    Kerber, Andreas ; Srinivasan, P.

  • Author_Institution
    Globalfoundries, Inc., Yorktown Heights, NY, USA
  • Volume
    35
  • Issue
    4
  • fYear
    2014
  • fDate
    Apr-14
  • Firstpage
    431
  • Lastpage
    433
  • Abstract
    Stochastic bias temperature instability (BTI) modeling has gained importance for scaled metal gate/high- k CMOS devices to ensure SRAM circuit functionality. In this letter, we discuss the impact of the BTI stress mode on the ΔVT distribution and the time evolution of VT in small and large area CMOS devices. It is shown that the stress mode has strong impact on the evolution of the threshold voltage distribution in small area devices leading to an increase in the σ-value for constant overdrive stress, whereas no change is observed for constant voltage stress. Since CMOS circuits share the supply voltage, the constant voltage stress σ-values are relevant and thus, the reliability guidance for future CMOS design should be based on constant voltage stress.
  • Keywords
    CMOS integrated circuits; SRAM chips; high-k dielectric thin films; integrated circuit modelling; integrated circuit reliability; negative bias temperature instability; stochastic processes; σ-value; SRAM circuit functionality; constant overdrive stress; constant voltage stress; reliability guidance; scaled metal gate-high-k CMOS devices; stochastic BTI modeling; stochastic bias temperature instability; stress mode; threshold voltage distribution; CMOS integrated circuits; Correlation; Field effect transistors; Logic gates; Stochastic processes; Stress; Threshold voltage; Bias temperature instability; CMOS devices; high-$k$ dielectrics; metal gate; variability;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2014.2304532
  • Filename
    6748015