DocumentCode
4041
Title
Impact of Stress Mode on Stochastic BTI in Scaled MG/HK CMOS Devices
Author
Kerber, Andreas ; Srinivasan, P.
Author_Institution
Globalfoundries, Inc., Yorktown Heights, NY, USA
Volume
35
Issue
4
fYear
2014
fDate
Apr-14
Firstpage
431
Lastpage
433
Abstract
Stochastic bias temperature instability (BTI) modeling has gained importance for scaled metal gate/high- k CMOS devices to ensure SRAM circuit functionality. In this letter, we discuss the impact of the BTI stress mode on the ΔVT distribution and the time evolution of VT in small and large area CMOS devices. It is shown that the stress mode has strong impact on the evolution of the threshold voltage distribution in small area devices leading to an increase in the σ-value for constant overdrive stress, whereas no change is observed for constant voltage stress. Since CMOS circuits share the supply voltage, the constant voltage stress σ-values are relevant and thus, the reliability guidance for future CMOS design should be based on constant voltage stress.
Keywords
CMOS integrated circuits; SRAM chips; high-k dielectric thin films; integrated circuit modelling; integrated circuit reliability; negative bias temperature instability; stochastic processes; σ-value; SRAM circuit functionality; constant overdrive stress; constant voltage stress; reliability guidance; scaled metal gate-high-k CMOS devices; stochastic BTI modeling; stochastic bias temperature instability; stress mode; threshold voltage distribution; CMOS integrated circuits; Correlation; Field effect transistors; Logic gates; Stochastic processes; Stress; Threshold voltage; Bias temperature instability; CMOS devices; high-$k$ dielectrics; metal gate; variability;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2014.2304532
Filename
6748015
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