Thermal management of multichipmodule (MCM) using genetic algorithms

Author

Jeevan, K. ; Seetharamu, K.N. ; Ishak, I.A. ; Quadir, G.A.

Author_Institution

Sch. of Mech. Eng., Univ. of Sci. Malaysia, Penang, Malaysia

Volume

1

fYear

2003

fDate

15-17 Oct. 2003

Firstpage

474

Abstract

The placement of power dissipating chips for a multichip module (MCM) is carried out using genetic algorithms. Since high power is to be dissipated over a small area of a module, the heat must be conducted away efficiently. The main design issue is to achieve uniform thermal distribution. The placement of uniform power dissipating chips is tested using an odd and even number of placement locations. Then the chips with non-uniform power are placed and the results obtained compare well with the force-directed method and quadrisection method.

Keywords

circuit layout; circuit optimisation; genetic algorithms; heat conduction; multichip modules; temperature distribution; thermal management (packaging); MCM thermal management; genetic algorithms; heat conduction; high power dissipation module; multichip module; power dissipating chip placement; uniform thermal distribution; Algorithm design and analysis; Biological cells; Equations; Genetic algorithms; Genetic mutations; Mechanical engineering; Power dissipation; Thermal conductivity; Thermal force; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

TENCON 2003. Conference on Convergent Technologies for the Asia-Pacific Region

Print_ISBN

0-7803-8162-9

Type

conf

DOI

10.1109/TENCON.2003.1273367

Filename

1273367