Design and analysis of optical subassembly (OSA) used in high speed parallel transmission package

Author

Lin, Samuel I-En ; Liu, Yang-Liang

Author_Institution

Electr. Eng. Dept., Chung-Chou Inst. of Technol., Yuan-Lin, Taiwan

Volume

1

fYear

2003

fDate

15-19 Dec. 2003

Abstract

The major market trends for optical systems are pushing for low-cost packages that integrate two or more discrete device functions in a small footprint This paper experimentally shows the coupling efficiency of proposed structure used for high-speed parallel transmission. The 3D finite element modeling was used to investigate the mechanical stress performance and thermal analysis. The idealized ball lens-fiber coupling derivation is also included in this paper. The finite element results indicated the selection and mechanical strength of sapphire substrate are critical to the optical performance.

Keywords

chip scale packaging; finite element analysis; high-speed optical techniques; integrated optics; lenses; optical fibres; packaging; sapphire; stress analysis; thermal analysis; 3D finite element modeling; Al₂O₃; ball lens-fiber coupling derivation; coupling efficiency; high speed parallel transmission package; integrated discrete device; low-cost packages; mechanical stress performance; optical subassembly design; optical systems; sapphire substrate; thermal analysis; Finite element methods; High speed optical techniques; Lenses; Optical coupling; Optical design; Optical fiber communication; Optical fiber devices; Packaging; Substrates; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Lasers and Electro-Optics, 2003. CLEO/Pacific Rim 2003. The 5th Pacific Rim Conference on

Print_ISBN

0-7803-7766-4

Type

conf

DOI

10.1109/CLEOPR.2003.1274734

Filename

1274734