DocumentCode :
405744
Title :
Moving forward: the power challenge
Author :
Kawa, Jacek
Author_Institution :
Adv.Technol. Group, Synopsys Inc., Mountain View, CA, USA
Volume :
1
fYear :
2003
fDate :
21-24 Oct. 2003
Abstract :
DSM has allowed integrated desktop and portable applications in computing and telecommunications to operate at very high frequencies-dissipating a lot of power in a relatively small area. Unfortunately these fast devices are leaky! Power dissipation technologies (packages, fans, etc.) are expensive, and, battery technology could not keep up with the added demand of hand-held devices for power. Also, high frequencies coupled With high densities have created localized high power densities that posed an integrity issue in chips even when overall power dissipation was not excessive. Power budgeting and low power circuit and software techniques are at the forefront of system design. This tutorial will cover the power challenge and propose useful solutions.
Keywords :
demand side management; integrated circuit design; system-on-chip; DSM; SOC; battery technology; demand side management; hand held devices; high frequency operation; high power density; integrated circuit design; integrated desktop application; low power circuit; portable application; power dissipation technologies; software techniques; system design; system-on-chip; telecommunication;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ASIC, 2003. Proceedings. 5th International Conference on
ISSN :
1523-553X
Print_ISBN :
0-7803-7889-X
Type :
conf
DOI :
10.1109/ICASIC.2003.1277484
Filename :
1277484
Link To Document :
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