DocumentCode
406076
Title
Characteristics of cantilever beam fabricated by silicon micromachining for flow sensor application
Author
Kim, Young-Min ; Seo, Chang-Taeg ; Eun, Duk-Soo ; Park, Sung-Gen ; Jo, Chan-Seop ; Lee, Jong-Hyun
Volume
1
fYear
2003
fDate
22-24 Oct. 2003
Firstpage
642
Abstract
In this paper we report the thermal stress characteristics of multiarray cantilever beam and the result of experimental researches. The cantilever beam was fabricated using porous silicon micromachining techniques, surface tension and the difference in the thermal expansion coefficients between the two films on the cantilever beam. Then the height of the curled cantilever beam is measured as a function of the annealing temperature and time. Using these results, Piezoresistive flow sensors with micro cantilever structure were fabricated using (100), n/n+/n three layer silicon wafer and their characteristics were then investigated. The proposed micro flow sensor consists of four identical silicon cantilever beam with piezoresistors. The total resistance and sheet resistance were obtained about 1KΩ and 50Ω respectively. The results show the dependence of the sensitivity on cantilever length and geometry.
Keywords
flow measurement; micromachining; microsensors; piezoresistive devices; surface tension; thermal expansion; thermal stresses; 1 kohm; 50 ohm; annealing temperature; microcantilever structure; microflow sensor; multiarray cantilever beam; piezoresistive flow sensors; piezoresistors; porous silicon micromachining; sheet resistance; silicon cantilever beam; surface tension; thermal expansion coefficients; thermal stress characteristics; Annealing; Micromachining; Semiconductor films; Sensor phenomena and characterization; Silicon; Structural beams; Surface tension; Thermal expansion; Thermal stresses; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2003. Proceedings of IEEE
Print_ISBN
0-7803-8133-5
Type
conf
DOI
10.1109/ICSENS.2003.1279016
Filename
1279016
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