Title :
Multifunction Residue Architectures for Cryptography
Author :
Schinianakis, Dimitrios ; Stouraitis, Thanos
Author_Institution :
Electr. & Comput. Eng. Dept., Univ. of Patras, Patras, Greece
Abstract :
A design methodology for incorporating Residue Number System (RNS) and Polynomial Residue Number System (PRNS) in Montgomery modular multiplication in GF(p) or GF(2n) respectively, as well as a VLSI architecture of a dual-field residue arithmetic Montgomery multiplier are presented in this paper. An analysis of input/output conversions to/from residue representation, along with the proposed residue Montgomery multiplication algorithm, reveals common multiply-accumulate data paths both between the converters and between the two residue representations. A versatile architecture is derived that supports all operations of Montgomery multiplication in GF(p) and GF(2n), input/output conversions, Mixed Radix Conversion (MRC) for integers and polynomials, dual-field modular exponentiation and inversion in the same hardware. Detailed comparisons with state-of-the-art implementations prove the potential of residue arithmetic exploitation in dual-field modular multiplication.
Keywords :
Galois fields; cryptography; polynomials; residue number systems; MRC; Montgomery modular multiplication; Montgomery multiplication algorithm; PRNS; VLSI architecture; cryptography; dual-field modular exponentiation; dual-field modular multiplication; dual-field residue arithmetic Montgomery multiplier; input/output conversions; integers; mixed radix conversion; multifunction residue architectures; multiply-accumulate data paths; polynomial residue number system; polynomials; residue arithmetic exploitation; residue representation; versatile architecture; Algorithm design and analysis; Computer architecture; Computers; Cryptography; Europe; Hardware; Polynomials; Computations in finite fields; Montgomery multiplication; computer arithmetic; parallel arithmetic and logic structures;
Journal_Title :
Circuits and Systems I: Regular Papers, IEEE Transactions on
DOI :
10.1109/TCSI.2013.2283674