Title :
Effectiveness of ∇VF test to detect solder integrity in power diode
Author :
Tan, Cher Ming ; Gan, Zhenghao
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
Abstract :
∇VF test is a common electrical test in power diode industry for the evaluation of the integrity of solder contact between the leads and the dice. Whereas the test is effective to detect devices with voids in solder, it is found that the test is not possible to detect devices with solder under-coverage. A finite element (FE) analysis is performed to understand the effect of solder under-coverage on the thermal resistance. Both the simulation results and the experimental results will be shown in this work. A novel method to detect the solder under-coverage will be presented, and the results will be shown.
Keywords :
finite element analysis; power semiconductor diodes; semiconductor device manufacture; solders; testing; thermal resistance; ∇VF test; electrical resistance; electrical test; finite element analysis; power diode industry; solder integrity; solder undercoverage; thermal resistance measurement; Copper; Diodes; Electric resistance; Finite element methods; Solid modeling; Temperature dependence; Temperature sensors; Testing; Thermal conductivity; Thermal resistance;
Conference_Titel :
Power Electronics and Drive Systems, 2003. PEDS 2003. The Fifth International Conference on
Print_ISBN :
0-7803-7885-7
DOI :
10.1109/PEDS.2003.1282673
