• DocumentCode
    407295
  • Title

    Effectiveness of ∇VF test to detect solder integrity in power diode

  • Author

    Tan, Cher Ming ; Gan, Zhenghao

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore
  • Volume
    1
  • fYear
    2003
  • fDate
    17-20 Nov. 2003
  • Firstpage
    38
  • Abstract
    ∇VF test is a common electrical test in power diode industry for the evaluation of the integrity of solder contact between the leads and the dice. Whereas the test is effective to detect devices with voids in solder, it is found that the test is not possible to detect devices with solder under-coverage. A finite element (FE) analysis is performed to understand the effect of solder under-coverage on the thermal resistance. Both the simulation results and the experimental results will be shown in this work. A novel method to detect the solder under-coverage will be presented, and the results will be shown.
  • Keywords
    finite element analysis; power semiconductor diodes; semiconductor device manufacture; solders; testing; thermal resistance; ∇VF test; electrical resistance; electrical test; finite element analysis; power diode industry; solder integrity; solder undercoverage; thermal resistance measurement; Copper; Diodes; Electric resistance; Finite element methods; Solid modeling; Temperature dependence; Temperature sensors; Testing; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Drive Systems, 2003. PEDS 2003. The Fifth International Conference on
  • Print_ISBN
    0-7803-7885-7
  • Type

    conf

  • DOI
    10.1109/PEDS.2003.1282673
  • Filename
    1282673
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=407295