DocumentCode
407299
Title
Contribution to the dimensioning of the different insulating materials used in high voltage power electronics module manufacturing
Author
Lebey, T. ; Malec, D. ; Bley, V. ; Breit, F. ; Dutarde, E.
Author_Institution
Univ. Paul Sabatier, Toulouse, France
Volume
1
fYear
2003
fDate
17-20 Nov. 2003
Firstpage
55
Abstract
In railways applications high voltage IGBT power modules are used to build power converters. Such an approach allows increasing at the same time the reliability, the thermal and electrical performances, to decrease the cost and to achieve an improved design. From a material point of view, such modules have to be considered as a stack of different types of materials. Among them, the dielectric materials, both organic and inorganic, suffer from a lack of knowledge of their properties. This paper describes the step by step method which has been followed to study different ceramic substrates and encapsulation materials in order to get a better understanding of their properties and their ability to be used in such a structure. Choice and dimensioning criteria will be presented.
Keywords
ceramics; dielectric materials; encapsulation; insulated gate bipolar transistors; insulating materials; power bipolar transistors; silicones; substrates; ceramic substrates; dielectric materials; electrical performances; high voltage power electronics module manufacturing; inorganic materials; insulating materials; organic materials; power converters; railways applications; reliability; silicone gels; soft encapsulation materials; thermal performances; Ceramics; Costs; Dielectric materials; Insulated gate bipolar transistors; Insulation; Manufacturing; Multichip modules; Power electronics; Rail transportation; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Drive Systems, 2003. PEDS 2003. The Fifth International Conference on
Print_ISBN
0-7803-7885-7
Type
conf
DOI
10.1109/PEDS.2003.1282678
Filename
1282678
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