DocumentCode :
407300
Title :
Tunable oxide-bypassed superjunction structure: breaking the silicon performance limit
Author :
Yang, Xin ; Liang, Yung C. ; Samudra, Ganesh S. ; Liu, Yong
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
Volume :
1
fYear :
2003
fDate :
17-20 Nov. 2003
Firstpage :
66
Abstract :
We have recently reported an oxide-bypassed (OB) superjunction structure that utilizes the well-established oxide thickness control in fabrication instead of the difficult doping control in translating the unipolar on-resistance Ron versus the blocking voltage VBR tradeoff limit beyond the conventional unipolar silicon limit [Y.C. Liang et al., August 2001]. Further enhancement on the breakdown voltage to compensate process variation can be achieved by applying an external bias to the poly contact of the OB trench. This bias provides an independent control in adjusting maximum breakdown voltage. This paper describes the fabrication process and the laboratory results on the tunable oxide-bypassed superjunction structure.
Keywords :
power MOSFET; semiconductor doping; silicon; blocking voltage; doping control; fabrication process; maximum breakdown voltage; metal-oxide-semiconductor field effect transistor; oxide thickness control; power MOSFET; silicon performance limit; superjunction devices; tunable oxide-bypassed superjunction structure; unipolar silicon limit; Doping profiles; Electric breakdown; Electrodes; Fabrication; Medical simulation; Microelectronics; PIN photodiodes; Silicon; Thickness control; Voltage control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Drive Systems, 2003. PEDS 2003. The Fifth International Conference on
Print_ISBN :
0-7803-7885-7
Type :
conf
DOI :
10.1109/PEDS.2003.1282680
Filename :
1282680
Link To Document :
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