• DocumentCode
    407569
  • Title

    Leveraging delay slack in flip-flop and buffer insertion for power reduction

  • Author

    Simonson, Lucanus ; Tam, King Ho ; Akkiraju, Nataraj ; Mohan, Mosur ; He, Lie

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    69
  • Lastpage
    74
  • Abstract
    We show that the delay slack can be distributed optimally between flip-flops to reduce power in a pipelined interconnect, and such power reduction can be achieved by simultaneous flip-flop and buffer insertion satisfying latency and delay constraints specified at sinks. We develop a dynamic programming algorithm with effective pruning rules and pseudo polynomial time complexity with respect to the decimation and the length of a net. Experiments using a cluster of interconnect in a leading industrial high-performance design show that there exists plenty of useful slack for power reduction. Without jeopardizing the delay specification, as much as 17% of power can be saved for this cluster of interconnects.
  • Keywords
    SPICE; buffer storage; circuit complexity; circuit layout CAD; circuit optimisation; dynamic programming; flip-flops; integrated circuit layout; low-power electronics; network routing; SPICE simulation; buffer insertion; cluster of interconnect; delay constraints; delay slack leveraging; dominance property; dynamic programming algorithm; effective pruning rules; flip-flop insertion; high performance design; latency constraints; pipelined interconnect; power optimization; power reduction; pseudo polynomial time complexity; routing topology; routing tree; Delay; Flip-flops;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2004. Proceedings. 5th International Symposium on
  • Print_ISBN
    0-7695-2093-6
  • Type

    conf

  • DOI
    10.1109/ISQED.2004.1283652
  • Filename
    1283652