DocumentCode
407569
Title
Leveraging delay slack in flip-flop and buffer insertion for power reduction
Author
Simonson, Lucanus ; Tam, King Ho ; Akkiraju, Nataraj ; Mohan, Mosur ; He, Lie
Author_Institution
Dept. of Electr. Eng., California Univ., Los Angeles, CA, USA
fYear
2004
fDate
2004
Firstpage
69
Lastpage
74
Abstract
We show that the delay slack can be distributed optimally between flip-flops to reduce power in a pipelined interconnect, and such power reduction can be achieved by simultaneous flip-flop and buffer insertion satisfying latency and delay constraints specified at sinks. We develop a dynamic programming algorithm with effective pruning rules and pseudo polynomial time complexity with respect to the decimation and the length of a net. Experiments using a cluster of interconnect in a leading industrial high-performance design show that there exists plenty of useful slack for power reduction. Without jeopardizing the delay specification, as much as 17% of power can be saved for this cluster of interconnects.
Keywords
SPICE; buffer storage; circuit complexity; circuit layout CAD; circuit optimisation; dynamic programming; flip-flops; integrated circuit layout; low-power electronics; network routing; SPICE simulation; buffer insertion; cluster of interconnect; delay constraints; delay slack leveraging; dominance property; dynamic programming algorithm; effective pruning rules; flip-flop insertion; high performance design; latency constraints; pipelined interconnect; power optimization; power reduction; pseudo polynomial time complexity; routing topology; routing tree; Delay; Flip-flops;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2004. Proceedings. 5th International Symposium on
Print_ISBN
0-7695-2093-6
Type
conf
DOI
10.1109/ISQED.2004.1283652
Filename
1283652
Link To Document