• DocumentCode
    407577
  • Title

    PARADE: parametric delay evaluation under process variation [IC modeling]

  • Author

    Lu, Xiang ; Li, Zhuo ; Qiu, Wangqi ; Walker, D.M.H. ; Shi, Weiping

  • Author_Institution
    Dept. of Electr. Eng., Texas A&M Univ., College Station, TX, USA
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    276
  • Lastpage
    280
  • Abstract
    Under manufacturing process variation, the circuit delay varies with process parameters. For delay test and timing verification under process variation, it is necessary to model the variational delay as a function of process variables. However, conventional methods to generate such functions are either slow or inaccurate. In this paper, we present a number of new methods for fast parametric delay evaluation under process variation. Our methods are either based on explicit delay formulae or based on characterized lookup tables, and are significantly faster than conventional methods of comparable accuracy. Due to the efficiency of our method, we can accurately model any path delay as a function of multiple interconnect and device process variables in large circuits. Experimental results on ISCAS85 circuits show that the path delay error predicted by our methods is about 1% of that computed by the RSM using SPICE, where the path delay variation is within ±10%.
  • Keywords
    integrated circuit interconnections; integrated circuit modelling; semiconductor process modelling; table lookup; PARADE; RSM; SPICE; characterized lookup tables; delay test; manufacturing process variation; multiple interconnect variables; parametric delay evaluation; process parameter varying circuit delay; timing verification; Circuit testing; Computer science; Delay effects; Integrated circuit interconnections; Manufacturing processes; Performance analysis; SPICE; Table lookup; Timing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2004. Proceedings. 5th International Symposium on
  • Print_ISBN
    0-7695-2093-6
  • Type

    conf

  • DOI
    10.1109/ISQED.2004.1283686
  • Filename
    1283686