• DocumentCode
    407579
  • Title

    Design to avoid the over-gate-driven effect on ESD protection circuits in deep-submicron CMOS processes

  • Author

    Ker, Ming-Dou ; Chen, Wen-Yi

  • Author_Institution
    Inst. of Electron., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    445
  • Lastpage
    450
  • Abstract
    Although the gate-driven (or gate-coupled) technique was reported to improve ESD robustness of NMOS devices, the over-gate-driven effect has been found to degrade the ESD level. This effect makes the gate-driven technique difficult to be well optimized in deep-submicron CMOS ICs. In this work, a new design is proposed to overcome such over-gate-driven effect by circuit design and to achieve the maximum ESD capability of the devices. The experimental results have shown significant improvement on the machine-model (MM) ESD robustness of ESD protection circuits by this new proposed design. This new design is portable (process-migration) for applications in different CMOS processes without modifying the process step or mask layer.
  • Keywords
    CMOS integrated circuits; electrostatic discharge; integrated circuit design; 0.35 micron; CMOS processes; ESD protection circuits; NMOS device ESD robustness; gate-coupled technique; machine-model ESD robustness; over-gate-driven effect; process-migration; CMOS process; Circuit testing; Degradation; Electrostatic discharge; Fingers; Integrated circuit testing; MOS devices; Protection; Robustness; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design, 2004. Proceedings. 5th International Symposium on
  • Print_ISBN
    0-7695-2093-6
  • Type

    conf

  • DOI
    10.1109/ISQED.2004.1283714
  • Filename
    1283714