DocumentCode :
408380
Title :
Electromechanical and electromagnetic analyses of two- and three-plate voltage-controlled oscillators (VCOs) with micromachined tunable capacitors
Author :
Keating, Daniel J. ; Farina, Marco ; Jafri, Ijaz
Author_Institution :
Corning IntelliSense Corp., Wilmington, MA, USA
fYear :
2003
fDate :
5-7 May 2003
Firstpage :
10
Lastpage :
14
Abstract :
This work presents the simulation-based electromechanical and electromagnetic analyses of two-plate and three-plate CMOS voltage-controlled oscillators (VCOs). These oscillators, described in, use electromechanically tunable capacitors fabricated using the MUMPs process and integrated inductors. Numerical models for each capacitor design were constructed using appropriate dimensions and material properties. The effects of process-induced stresses and electrostatic fringing fields were incorporated in the design analyses of the capacitors. Coupled electromechanical analyses were performed to measure the behavior of the tunable capacitors as a function of the applied voltages. The two-plate capacitor has a nominal capacitance of 2.05 pF, is tunable to 3.08 pF, and has a Q-factor of 20 at 1 GHz and 11.6 at 2 GHz. The three-plate capacitor has a nominal capacitance of 4.0 pF, is tunable to 7.4 pF, and has a Q-factor of 15.4 at 1 GHz and 7.1 at 2 GHz. The electromagnetic analyses were performed using the Generalized Transverse Resonance-Diffraction (GTRD) method, a 3D integral equation approach well suited for quasi-planar structures involving thick conductors and dielectric discontinuities. Structures of this type usually prove to be challenging for standard 3D techniques (e.g. Finite Elements, Finite Differences, etc.) owing to their critical aspect ratio, while being ill-suited for the so-called 2.5 techniques, in which conductor thickness and dielectric discontinuities are hardly accounted for. The combination of electromechanical and electromagnetic simulations presented in this paper allows for complete analysis and optimization of RF MEMS devices to be performed at the simulation stage.
Keywords :
CMOS analogue integrated circuits; Q-factor; capacitors; finite difference methods; finite element analysis; inductors; integral equations; integrated circuit modelling; internal stresses; micromechanical devices; optimisation; radiofrequency oscillators; semiconductor device models; voltage-controlled oscillators; 1 to 20 GHz; 2.05 pF; 3.08 pF; 3D integral equation; 4.0 pF; 7.4 pF; MUMPs process; Q-factor; RF MEMS devices; VCO; capacitance; capacitor design; dielectric discontinuities; electromagnetic analysis; electromagnetic simulations; electromechanical analysis; electrostatic fringing fields; finite difference analysis; finite elements analysis; generalized transverse resonance-diffraction; integrated inductors; micromachined tunable capacitors; optimization; process-induced stresses; quasiplanar structures; three-plate CMOS voltage-controlled oscillators; two-plate capacitor; Analytical models; Capacitance; Capacitors; Conductors; Dielectrics; Electromagnetic analysis; Inductors; Performance analysis; Q factor; Voltage-controlled oscillators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Test, Integration and Packaging of MEMS/MOEMS 2003. Symposium on
Print_ISBN :
0-7803-7066-X
Type :
conf
DOI :
10.1109/DTIP.2003.1287000
Filename :
1287000
Link To Document :
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