DocumentCode
408446
Title
A new lumped model for on-chip inductors including substrate currents
Author
Savio, A. ; Carmina, M. ; Richelli, A. ; Colalongo, L. ; Kovacs-Vajna, Zs M.
Author_Institution
Dept. of Electron., Univ. of Brescia, Italy
fYear
2003
fDate
9-11 Dec. 2003
Firstpage
180
Lastpage
183
Abstract
A new lumped model for on-chip planar (square, hexagonal, octagonal) inductors is presented. The model is simple, it is based on linear passive components with frequency independent parameters and accurately accounts for the substrate leakage currents in a wide frequency range. Furthermore, the model is straightforwardly implementable in circuit simulators such as, for example, SPICE.
Keywords
SPICE; circuit simulation; inductors; integrated circuit measurement; leakage currents; radiofrequency integrated circuits; SPICE; circuit simulation; leakage currents; linear passive components; lumped model; on-chip inductors; Bandwidth; Circuit simulation; Computational modeling; Finite element methods; Frequency; Inductance; Inductors; Maxwell equations; Spirals; Voltage-controlled oscillators;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics, 2003. ICM 2003. Proceedings of the 15th International Conference on
Print_ISBN
977-05-2010-1
Type
conf
DOI
10.1109/ICM.2003.1287759
Filename
1287759
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