• DocumentCode
    409266
  • Title

    Electrical breakdown studies with Mycalex insulators

  • Author

    Waldron, W. ; Greenway, W. ; Eylon, S. ; Henestroza, E. ; Yu, S.

  • Author_Institution
    Lawrence Berkeley Nat. Lab., CA, USA
  • Volume
    2
  • fYear
    2003
  • fDate
    12-16 May 2003
  • Firstpage
    1171
  • Abstract
    Insulating materials such as alumina and glass-bonded mica (Mycalex) are used in accelerator systems for high voltage feedthroughs, structural supports, and barriers between high voltage insulating oil and the vacuum beam pipe in induction accelerator cells. Electric fields in the triple points should be minimized to prevent voltage breakdown. Mechanical stress can compromise seals and result in oil contamination of the insulator surface. We have tested various insulator cleaning procedures including ultrasonic cleaning with a variety of aqueous-based detergents, and manual scrubbing with various detergents. Water sheeting tests were used to determine the initial results of the cleaning methods. Ultimately, voltage breakdown tests will be used to quantify the benefits of these cleaning procedures.
  • Keywords
    alumina; electric breakdown; insulating oils; mica; ultrasonic cleaning; Mycalex insulators; accelerator systems; alumina; aqueous-based detergents; electric fields; electrical breakdown; glass-bonded mica; high voltage feedthroughs; high voltage insulating oil; induction accelerator cells; insulating materials; insulator cleaning procedures; insulator surface; mechanical stress; oil contamination; structural supports; ultrasonic cleaning; vacuum beam pipe; voltage breakdown; water sheeting tests; Cleaning; Dielectric breakdown; Dielectrics and electrical insulation; Electric breakdown; Oil insulation; Particle beams; Petroleum; Testing; Vacuum systems; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Particle Accelerator Conference, 2003. PAC 2003. Proceedings of the
  • ISSN
    1063-3928
  • Print_ISBN
    0-7803-7738-9
  • Type

    conf

  • DOI
    10.1109/PAC.2003.1289642
  • Filename
    1289642