Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods

Author

Jahnes, C.V. ; Cotte, J. ; Lund, J.L. ; Deligianni, H. ; Chinthakindi, A. ; Buchwalter, L.P. ; Fryer, P. ; Tornello, J.A. ; Hoivik, N. ; Magerlein, J.H. ; Seeger, D.

Author_Institution

IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA

fYear

2004

fDate

2004

Firstpage

789

Lastpage

792

Abstract

This paper describes the successful concurrent fabrication of micro-electro-mechanical (MEM) electrostatic switches and resonators on the same wafer. Base processes from copper interconnect technology were used to fabricate devices allowing for easy introduction of MEMS technology into CMOS IC manufacturing. Both switches and resonators were electrically tested in a controlled ambient to determine performance and characteristics.

Keywords

CMOS integrated circuits; copper; electrostatic devices; integrated circuit interconnections; integrated circuit manufacture; micromechanical resonators; microswitches; radiofrequency integrated circuits; CMOS IC manufacturing; Cu; RF MEMS resonators fabrication; RF MEMS switches fabrication; complementary metal oxide semiconductor; copper based CMOS interconnection; electrostatic switches; radiofrequency microelectromechanical system; CMOS integrated circuits; CMOS process; CMOS technology; Copper; Electrostatics; Fabrication; Manufacturing; Micromechanical devices; Radiofrequency microelectromechanical systems; Switches;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)

Print_ISBN

0-7803-8265-X

Type

conf

DOI

10.1109/MEMS.2004.1290703

Filename

1290703