Title :
Simultaneous fabrication of RF MEMS switches and resonators using copper-based CMOS interconnect manufacturing methods
Author :
Jahnes, C.V. ; Cotte, J. ; Lund, J.L. ; Deligianni, H. ; Chinthakindi, A. ; Buchwalter, L.P. ; Fryer, P. ; Tornello, J.A. ; Hoivik, N. ; Magerlein, J.H. ; Seeger, D.
Author_Institution :
IBM T.J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
This paper describes the successful concurrent fabrication of micro-electro-mechanical (MEM) electrostatic switches and resonators on the same wafer. Base processes from copper interconnect technology were used to fabricate devices allowing for easy introduction of MEMS technology into CMOS IC manufacturing. Both switches and resonators were electrically tested in a controlled ambient to determine performance and characteristics.
Keywords :
CMOS integrated circuits; copper; electrostatic devices; integrated circuit interconnections; integrated circuit manufacture; micromechanical resonators; microswitches; radiofrequency integrated circuits; CMOS IC manufacturing; Cu; RF MEMS resonators fabrication; RF MEMS switches fabrication; complementary metal oxide semiconductor; copper based CMOS interconnection; electrostatic switches; radiofrequency microelectromechanical system; CMOS integrated circuits; CMOS process; CMOS technology; Copper; Electrostatics; Fabrication; Manufacturing; Micromechanical devices; Radiofrequency microelectromechanical systems; Switches;
Conference_Titel :
Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
Print_ISBN :
0-7803-8265-X
DOI :
10.1109/MEMS.2004.1290703
