DocumentCode
409523
Title
Ultracompliant, passively decoupled thermal probe arrays: large area mapping of non-planar surfaces without force feedback
Author
McNamara, Shamus ; Basu, Amar ; Lee, Joohyung ; Gianchandani, Yogesh B.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
fYear
2004
fDate
2004
Firstpage
825
Lastpage
828
Abstract
This paper describes an 8-probe system for scanning thermal microscopy. The design of the probe array, along with the choice of polyimide as the structural material provides very large compliance that virtually eliminates the need for z-axis mechanical feedback both at the chip and probe level in contact mode scans. The high compliance accommodates significant variations in the sample surface, and also prevents damage to soft samples. In addition, since integrated actuators and accompanying circuitry are no longer required, the prospect of scaling to large numbers of probes for high speed, high resolution thermal mapping of large areas with simple detection circuitry is enhanced. Based on single probes fabricated in the same process, the estimated spatial resolution, thermal conductance resolution, and temperature resolution are 50 nm, 11 pW/K, and 1.2 mK respectively. Scalability and performance of the 8-probe prototype are evaluated, addressing issues of speed vs. resolution, thermal and mechanical decoupling. Results demonstrate that contact mode scans can provide better than 2 μm spatial resolution at speeds greater than 200 μm/sec with each probe.
Keywords
scaling circuits; scanning probe microscopy; 1.2 mK; area mapping; compliance; detection circuit; integrated actuators; mechanical decoupling; nonplanar surfaces; passively decoupled thermal probe arrays; scanning thermal microscopy; spatial resolution; thermal conductance resolution; thermal decoupling; Actuators; Circuits; Force feedback; Microscopy; Polyimides; Probes; Spatial resolution; Temperature; Thermal conductivity; Thermal force;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2004. 17th IEEE International Conference on. (MEMS)
Print_ISBN
0-7803-8265-X
Type
conf
DOI
10.1109/MEMS.2004.1290712
Filename
1290712
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