DocumentCode :
410118
Title :
Fabrication and characterization of cMUTs for forward looking intravascular ultrasound imaging
Author :
Knight, Joshua G. ; Degertekin, F. Levent
Author_Institution :
G.W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
2
fYear :
2003
fDate :
5-8 Oct. 2003
Firstpage :
1175
Abstract :
We have fabricated ring annular capacitive micromachined ultrasonic transducer (cMUT) arrays for forward looking IVUS operation in the 10 to 20MHz range with a maximum process temperature of 250°C. Our process uses a low stress plasma enhanced chemical vapor deposition (PECVD) silicon nitride membrane and provides localized sealing. The process is demonstrated on both silicon and dielectric substrates showing the potential for post-CMOS electronics integration and optical detection techniques while providing test arrays with significantly reduced parasitic capacitance. Arrays of 64 and 32 elements with approximately 1mm diameter have been fabricated. Measured pulse echo response in oil show that the cMUT has more than 70% fractional bandwidth around 15MHz, which is suitable for IVUS. Initial imaging results of an ultrasound source using a 16 element receive-only array are presented.
Keywords :
biomedical ultrasonics; capacitive sensors; micromachining; plasma CVD; ultrasonic imaging; ultrasonic transducer arrays; 10 to 20 MHz; 15 MHz; 250 C; IVUS operation; capacitive micromachined ultrasonic transducer; dielectric substrates; intravascular ultrasound imaging; localized sealing; optical detection; parasitic capacitance; plasma enhanced chemical vapor deposition; post-CMOS electronics integration; pulse echo response; receive-only array; ring annular cMUT arrays; silicon nitride membrane; test arrays; ultrasound source; Electronic equipment testing; Fabrication; Optical arrays; Optical imaging; Plasma temperature; Pulse measurements; Silicon; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
Type :
conf
DOI :
10.1109/ULTSYM.2003.1293110
Filename :
1293110
Link To Document :
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