• DocumentCode
    410118
  • Title

    Fabrication and characterization of cMUTs for forward looking intravascular ultrasound imaging

  • Author

    Knight, Joshua G. ; Degertekin, F. Levent

  • Author_Institution
    G.W. Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    2
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    1175
  • Abstract
    We have fabricated ring annular capacitive micromachined ultrasonic transducer (cMUT) arrays for forward looking IVUS operation in the 10 to 20MHz range with a maximum process temperature of 250°C. Our process uses a low stress plasma enhanced chemical vapor deposition (PECVD) silicon nitride membrane and provides localized sealing. The process is demonstrated on both silicon and dielectric substrates showing the potential for post-CMOS electronics integration and optical detection techniques while providing test arrays with significantly reduced parasitic capacitance. Arrays of 64 and 32 elements with approximately 1mm diameter have been fabricated. Measured pulse echo response in oil show that the cMUT has more than 70% fractional bandwidth around 15MHz, which is suitable for IVUS. Initial imaging results of an ultrasound source using a 16 element receive-only array are presented.
  • Keywords
    biomedical ultrasonics; capacitive sensors; micromachining; plasma CVD; ultrasonic imaging; ultrasonic transducer arrays; 10 to 20 MHz; 15 MHz; 250 C; IVUS operation; capacitive micromachined ultrasonic transducer; dielectric substrates; intravascular ultrasound imaging; localized sealing; optical detection; parasitic capacitance; plasma enhanced chemical vapor deposition; post-CMOS electronics integration; pulse echo response; receive-only array; ring annular cMUT arrays; silicon nitride membrane; test arrays; ultrasound source; Electronic equipment testing; Fabrication; Optical arrays; Optical imaging; Plasma temperature; Pulse measurements; Silicon; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293110
  • Filename
    1293110