• DocumentCode
    410154
  • Title

    Capacitive ultrasonic transducers with a new vibrating structure

  • Author

    Pappalardo, M. ; Caliano, G. ; Caronti, A. ; D´Alessio, F. ; Cucco, C. ; Cianci, E. ; Foglietti, V.

  • Author_Institution
    Dipt. di Ingegneria Elettronica, Universita Roma Tre, Italy
  • Volume
    2
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    1955
  • Abstract
    In this work an electrostatic micromachined ultrasonic transducer using a new vibrating structure is described. The basic idea is to use a single thin plate suspended by means of a regular grid of small diameter columns. We show that this structure is able to vibrate, all in phase. The new transducer shows many potential advantages over the typical electrostatic cMUT: better transmission efficiency and reception sensitivity because the inactive area used by the column constraints is about 30% less than that used by the rails of the cMUT cells; for the same reason also a better reflection coefficient is expected. Because the virtual micro-cells of the device are not separated from each other there is no need to operate one or more holes to evacuate the micro-cells as in the typical cMUT technology; this means a better spatial uniformity of the mechanical characteristics of the vibrating plate and, in turn, less spurious vibration modes and improved mechanical reliability.
  • Keywords
    capacitive sensors; electrostatic devices; micromachining; plates (structures); ultrasonic transducers; vibrations; cMUT cells; capacitive ultrasonic transducers; electrostatic micromachined ultrasonic transducer; microcells; plate vibration; rails; reception sensitivity; reflection coefficient; spatial uniformity; structure vibration; thin plate; transmission efficiency; vibration modes; Bandwidth; Biomembranes; Electrodes; Electrostatics; Phased arrays; Piezoelectric transducers; Silicon; Ultrasonic transducers; Vibrations; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293300
  • Filename
    1293300