Improving the thermal stability of 1-3 piezoelectric composite transducers manufactured using thermally conductive polymeric fillers

Author

Parr, A.C.S. ; Leary, R. L O ; Hayward, G. ; Smillie, G.

Author_Institution

Dept. of Electron. & Electr. Eng., Strathclyde Univ., Glasgow, UK

Volume

1

fYear

2003

fDate

5-8 Oct. 2003

Firstpage

362

Abstract

With a view to improving the thermal stability of ultrasonic transducers prepared using 1-3 piezoelectric composites, the use of front face layers manufactured from thermally insulating and partially thermally conductive polymeric materials has been investigated. Experimentally, heat dissipation was investigated, in air and in water, using different transducer configurations and the advantage of including a front face layer manufactured from thermally conductive polymeric material is demonstrated. The PZFlex finite element modelling package was utilised to assess the thermal diffusivity of each polymer in the different transducer configurations and was found to compare well with experiment.

Keywords

composite materials; conducting polymers; finite element analysis; piezoelectric materials; piezoelectric transducers; thermal conductivity; thermal diffusivity; ultrasonic transducers; finite element modelling; heat dissipation; piezoelectric composite transducers; thermal diffusivity; thermal stability; thermally conductive polymeric fillers; ultrasonic transducers; Composite materials; Conducting materials; Manufacturing; Piezoelectric materials; Piezoelectric transducers; Plastic insulation; Polymers; Thermal conductivity; Thermal stability; Ultrasonic transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics, 2003 IEEE Symposium on

Print_ISBN

0-7803-7922-5

Type

conf

DOI

10.1109/ULTSYM.2003.1293423

Filename

1293423