• DocumentCode
    410229
  • Title

    Robust capacitive MEMS ultrasonics transducers for liquid immersion

  • Author

    Greve, D.W. ; Neumann, J.J. ; Oppenheim, I.J. ; Pessiki, S.P. ; Ozevin, D.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • Volume
    1
  • fYear
    2003
  • fDate
    5-8 Oct. 2003
  • Firstpage
    581
  • Abstract
    Capacitive diaphragm MEMS ultrasonic transducers are of great interest because they offer wide bandwidth and ready integration into arrays. However, fragility of these transducers is a significant barrier to their application. In this talk, we report on robust transducers which have been fabricated using the MUMPS process. The transducer design has been optimized to minimize stray capacitance between the output node and the substrate. We report the use of a protective silicone layer which protects the transducers from liquid exposure and, to a degree, from mechanical damage. The silicone layer has been applied with high transducer yield without the need for prior closure of the etch holes, and coated transducers survive extended immersion in water. The thickness of the silicone layer must be carefully controlled, however, in order to prevent pulse distortion.
  • Keywords
    capacitive sensors; micromechanical devices; ultrasonic transducers; MUMPS proces; liquid immersion; mechanical damage; microelectromechanical system; multiuser MEMS process; protective silicone layer; pulse distortion prevention; robust capacitive MEMS ultrasonics transducers; Bandwidth; Capacitance; Design optimization; Etching; Micromechanical devices; Process design; Protection; Robustness; Ultrasonic transducer arrays; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics, 2003 IEEE Symposium on
  • Print_ISBN
    0-7803-7922-5
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2003.1293470
  • Filename
    1293470