Title :
Robust capacitive MEMS ultrasonics transducers for liquid immersion
Author :
Greve, D.W. ; Neumann, J.J. ; Oppenheim, I.J. ; Pessiki, S.P. ; Ozevin, D.
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Abstract :
Capacitive diaphragm MEMS ultrasonic transducers are of great interest because they offer wide bandwidth and ready integration into arrays. However, fragility of these transducers is a significant barrier to their application. In this talk, we report on robust transducers which have been fabricated using the MUMPS process. The transducer design has been optimized to minimize stray capacitance between the output node and the substrate. We report the use of a protective silicone layer which protects the transducers from liquid exposure and, to a degree, from mechanical damage. The silicone layer has been applied with high transducer yield without the need for prior closure of the etch holes, and coated transducers survive extended immersion in water. The thickness of the silicone layer must be carefully controlled, however, in order to prevent pulse distortion.
Keywords :
capacitive sensors; micromechanical devices; ultrasonic transducers; MUMPS proces; liquid immersion; mechanical damage; microelectromechanical system; multiuser MEMS process; protective silicone layer; pulse distortion prevention; robust capacitive MEMS ultrasonics transducers; Bandwidth; Capacitance; Design optimization; Etching; Micromechanical devices; Process design; Protection; Robustness; Ultrasonic transducer arrays; Ultrasonic transducers;
Conference_Titel :
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN :
0-7803-7922-5
DOI :
10.1109/ULTSYM.2003.1293470