DocumentCode
410250
Title
High frequency complex vibration systems using a complex vibration converter with diagonal slits
Author
Tsujino, Jiromaru ; Ihara, Shigeru ; Harada, Yoshiki ; Kasahara, Kohei ; Sakamaki, Yoshihide
Author_Institution
Fac.of Eng., Kanagawa Univ., Yokohama, Japan
Volume
1
fYear
2003
fDate
5-8 Oct. 2003
Firstpage
699
Abstract
The 130 kHz and 180 kHz ultrasonic complex vibration systems with welding tips vibrating elliptical to circular locus effective for packaging in microelectronics were studied. These systems are effective for direct welding of various electronic devices without solder. The complex vibration sources are using a longitudinal-torsional vibration converter with diagonal slits and driven using longitudinal vibration systems.
Keywords
copper; frequency convertors; polymers; welding; 130 to 180 kHz; circular locus; complex vibration sources; diagonal slits; electronic devices; longitudinal torsional vibration converter; longitudinal vibration systems; microelectronics; packaging; ultrasonic complex vibration converter; welding; welding tips; Cable insulation; Coatings; Copper; Electronics packaging; Frequency conversion; Microelectronics; Plastic insulation; Substrates; Welding; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN
0-7803-7922-5
Type
conf
DOI
10.1109/ULTSYM.2003.1293497
Filename
1293497
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