DocumentCode
410267
Title
Design of miniaturized RF SAW duplexer package
Author
Dong, Hao ; Wu, Thomas X. ; Cheema, Kamran S. ; Abbott, Benjamin P. ; Finch, Craig A. ; Foo, Hanna
Author_Institution
Univ. of Central Florida, Orlando, FL, USA
Volume
1
fYear
2003
fDate
5-8 Oct. 2003
Firstpage
807
Abstract
This paper provides a comprehensive methodology for accurate analysis and design of miniaturized RP SAW duplexer package. Full-wave analysis is applied to get the package model. Die and bonding wire modeling is also discussed. After that, improvement of the isolation is investigated. Simulation and measurement results are compared and excellent agreement is found. The technique developed in this paper reduces the design cycle time significantly and can be applied to various RP SAW device packages.
Keywords
electronics packaging; lead bonding; surface acoustic wave filters; surface acoustic waves; RP SAW device packages; bonding wire modeling; die modeling; fullwave analysis; miniaturized RF SAW duplexer package design; radiofrequency surface acoustic waves; Bonding; Electronics packaging; Filters; Radio frequency; Radio transmitters; Receivers; Receiving antennas; Surface acoustic wave devices; Surface acoustic waves; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics, 2003 IEEE Symposium on
Print_ISBN
0-7803-7922-5
Type
conf
DOI
10.1109/ULTSYM.2003.1293523
Filename
1293523
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