Title :
Six-pack IGBT dynamic electro-thermal model: parameter extraction and validation
Author :
Reichl, J. ; Berning, D. ; Hefner, A. ; Lai, J.-S.
Author_Institution :
Future Energy Electron. Center, Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Abstract :
An electro-thermal simulation model is developed for a six-pack IGBT power module. A measurement system suitable for extracting transient thermal data for short term, high-power heating conditions is used in this work for thermal model validation. A set of parameter extraction software tools is used to extract the electrical parameters as well as temperature dependent parameters associated with the IGBT die within the module.
Keywords :
electronic engineering computing; insulated gate bipolar transistors; multichip modules; direct-bond copper; electrical parameters; electro-thermal simulation model; high-power heating condition; insulated gate bipolar transistors; parameter extraction software tools; six-pack IGBT; temperature dependant parameters; thermal network; transient thermal data; Area measurement; Bridges; Data mining; Insulated gate bipolar transistors; NIST; Parameter extraction; Power system modeling; Semiconductor device measurement; Silicon; Temperature dependence;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2004. APEC '04. Nineteenth Annual IEEE
Print_ISBN :
0-7803-8269-2
DOI :
10.1109/APEC.2004.1295817
