Title :
Why the market is ready for a nonisolated DC/DC power module standard
Author :
Narveson, Brian ; Jones, Geoffrey
Author_Institution :
Texas Instruments Inc., Warrenville, IL, USA
Abstract :
The migration to intermediate bus architectures (IBAs) is driving an increase in the use of nonisolated DC/DC power modules. Footprint standardization could be the next evolutionary step in the nonisolated power module industry. This paper will discuss why the market is ready for standardization and describe the effort by industry leading power module manufacturers to introduce a standard footprint.
Keywords :
DC-DC power convertors; electrical products industry; power markets; DC/DC power module standard; footprint standardization; intermediate bus architectures; market standardization; nonisolated power module industry; power module manufacturers; Communication industry; Costs; Instruments; Isolation technology; Manufacturing industries; Multichip modules; Power supplies; Pulp manufacturing; Standardization; Telecommunications;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2004. APEC '04. Nineteenth Annual IEEE
Print_ISBN :
0-7803-8269-2
DOI :
10.1109/APEC.2004.1295831
