DocumentCode
411366
Title
Why the market is ready for a nonisolated DC/DC power module standard
Author
Narveson, Brian ; Jones, Geoffrey
Author_Institution
Texas Instruments Inc., Warrenville, IL, USA
Volume
1
fYear
2004
fDate
2004
Firstpage
335
Abstract
The migration to intermediate bus architectures (IBAs) is driving an increase in the use of nonisolated DC/DC power modules. Footprint standardization could be the next evolutionary step in the nonisolated power module industry. This paper will discuss why the market is ready for standardization and describe the effort by industry leading power module manufacturers to introduce a standard footprint.
Keywords
DC-DC power convertors; electrical products industry; power markets; DC/DC power module standard; footprint standardization; intermediate bus architectures; market standardization; nonisolated power module industry; power module manufacturers; Communication industry; Costs; Instruments; Isolation technology; Manufacturing industries; Multichip modules; Power supplies; Pulp manufacturing; Standardization; Telecommunications;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2004. APEC '04. Nineteenth Annual IEEE
Print_ISBN
0-7803-8269-2
Type
conf
DOI
10.1109/APEC.2004.1295831
Filename
1295831
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