DocumentCode
411881
Title
Wafer scale profiling of photonic integrated circuits
Author
Hudgings, J.A. ; Pipe, K.P. ; Ram, R.J.
Author_Institution
Phys. Dept., Mount Holyoke Coll., South Hadley, MA, USA
fYear
2003
fDate
6-6 June 2003
Abstract
We demonstrate a thermal profiling technique for wafer-scale testing of optical distribution in photonic integrated circuits. The technique is used to quantify the absorption coefficient of a subthreshold diode laser for varying operating conditions.
Keywords
absorption coefficients; integrated optics; optical testing; semiconductor lasers; thermo-optical effects; wafer-scale integration; absorption coefficient; photonic integrated circuits; subthreshold diode laser; thermal profiling technique; wafer scale testing; Absorption; Circuit testing; Diode lasers; Optical devices; Optical modulation; Optical receivers; Optical saturation; Optical waveguides; Photonic integrated circuits; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 2003. CLEO '03. Conference on
Conference_Location
Baltimore, MD, USA
Print_ISBN
1-55752-748-2
Type
conf
Filename
1298028
Link To Document