Title :
Femtosecond laser micromachined grooves cut in silicon with 400 nm and 800 nm pulses
Author :
Crawford, T.H.R. ; Borowiec, A. ; Haugen, R.K.
Author_Institution :
Brockhouse Inst. for Mater. Res., McMaster Univ., Hamilton, Ont., Canada
Abstract :
We present measurements of ablation rates, morphology, and geometry of femtosecond micromachined silicon under various machining conditions: variable pulse energy, variable cutting speed, number of consecutive passes, and wavelength.
Keywords :
elemental semiconductors; high-speed optical techniques; laser ablation; laser beam cutting; laser beam machining; micromachining; silicon; 400 nm; 800 nm; Si; ablation rate measurement; femtosecond laser; machining condition; micromachined grooves; morphology; silicon; variable cutting speed; variable pulse energy; Energy measurement; Geometrical optics; Laser ablation; Laser beam cutting; Morphology; Optical pulses; Pulse measurements; Silicon; Velocity measurement; Wavelength measurement;
Conference_Titel :
Lasers and Electro-Optics, 2003. CLEO '03. Conference on
Conference_Location :
Baltimore, MD, USA
Print_ISBN :
1-55752-748-2
