DocumentCode
412432
Title
Femtosecond laser micromachined grooves cut in silicon with 400 nm and 800 nm pulses
Author
Crawford, T.H.R. ; Borowiec, A. ; Haugen, R.K.
Author_Institution
Brockhouse Inst. for Mater. Res., McMaster Univ., Hamilton, Ont., Canada
fYear
2003
fDate
6-6 June 2003
Abstract
We present measurements of ablation rates, morphology, and geometry of femtosecond micromachined silicon under various machining conditions: variable pulse energy, variable cutting speed, number of consecutive passes, and wavelength.
Keywords
elemental semiconductors; high-speed optical techniques; laser ablation; laser beam cutting; laser beam machining; micromachining; silicon; 400 nm; 800 nm; Si; ablation rate measurement; femtosecond laser; machining condition; micromachined grooves; morphology; silicon; variable cutting speed; variable pulse energy; Energy measurement; Geometrical optics; Laser ablation; Laser beam cutting; Morphology; Optical pulses; Pulse measurements; Silicon; Velocity measurement; Wavelength measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics, 2003. CLEO '03. Conference on
Conference_Location
Baltimore, MD, USA
Print_ISBN
1-55752-748-2
Type
conf
Filename
1298583
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